These devices are ideal for direct driving low current motors or driving MOSFETs in a H-bridge configuration for higher current motor drive see Section 5. Having the logic gates onboard the driver can help to reduce component count in many designs. They can tolerate V of noise spiking on the ground line and can handle A of reverse current on the driver outputs. High Peak Output Current: 1. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
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Each driver has been equipped with a two-input logic gate for added flexibility. Heavily loaded clock lines, coaxial cables, and piezoelectric transducers can all be easily driven with the X series drivers.
The only limitation on loading is that total power dissipation in the IC must be kept within the power dissipation limits of the package. The TCX series will not latch under any conditions within their power and voltage ratings. They are not subject 4 to damage when up to 5V of noise spiking either polarity occurs on the ground line. They can accept up to half an amp of inductive kickback current either polarity into their outputs without damage or logic upset. In addition, all terminals are protected against ESD to at least V.
Unused devices must be stored in conductive material. Protect devices from static discharge and static fields. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied.
Exposure to Absolute Maximum Rating Conditions for extended periods may affect device reliability. Totem-pole outputs should not be paralleled because the propagation delay differences from one to the other could cause one driver to drive high a few nanoseconds before another. The resulting current spike, although short, may decrease the life of the device. When driving all four outputs simultaneously in the same direction, VDD shall be limited to 16V. The input threshold has about 50 mV of hysteresis centered at approximately 1.
Slow moving inputs will force the device to dissipate high peak currents as the input transitions through this band. Input rise times should be kept below 5? Static input levels should also be maintained above the maximum or below the minimum input levels specified in the "Electrical Characteristics" to avoid increased power dissipation in the device.
For example, charging a pF load to 18V in 25nsec requires 0. To guarantee low supply impedance over a wide frequency range, a 1? F film capacitor in parallel with one or two low-inductance 0. Potential drops developed in common ground impedances from input to output will appear as negative feedback and degrade switching speed characteristics. Instead, individual ground returns for input and output circuits, or a ground plane, should be used.
Input Stage The input voltage level changes the no-load or quiescent supply current. With logic "0" outputs, maximum quiescent supply current is 4 mA.
Logic "1" output level signals reduce quiescent current to 1. Minimum power dissipation occurs for logic "1" outputs. The drivers are designed with 50 mV of hysteresis. This provides clean transitions and minimizes output stage current spiking when changing states. Input voltage thresholds are approximately 1. Input current is less than 1? A over this range. Power Dissipation The supply current versus frequency and supply current versus capacitive load characteristic curves will aid in determining power dissipation calculations.
Input signal duty cycle, power supply voltage and load type, influence package power dissipation. Given power dissipation and package thermal resistance, the maximum ambient operating temperature is easily calculated. The 14pin plastic package junction-to-ambient thermal resistance is A capacitive-load-caused dissipation driving MOSFET gates , is a direct function of frequency, capacitive load, and supply voltage.
A resistive-load-caused dissipation for ground-referenced loads is a function of duty cycle, load current, and load voltage. A resistive-load-caused dissipation for supply-referenced loads is a function of duty cycle, load current, and output voltage. Quiescent power dissipation depends on input signal duty cycle.
Logic HIGH outputs result in a lower power dissipation mode, with only 0. Logic LOW outputs raise the current to 4 mA maximum. Package power dissipation is the sum of load, quiescent and transition power dissipations. F FILM 0. Supply Voltage 2. RDS ON? Temperature 3.